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The indispensable prerequisite for development of reproducible technology of photomasks with design standards of 90–65 nm is the adhesion strength of functional layers. Thus the consideration of causes responsible for the adhesion of films and the effect of various factors on adhesion strength is an important task. In this work, the adhesion of the masking photoresist and thin-film functional layers (Cr, MoSiN, MoSiN/Cr) of photomasks and photomask blanks with design standards of 90–65 nm is investigated. A procedure for measuring the adhesion strength of films was developed. The studies were carried out on imported photomasks-prototypes and photomask blanks, on which functional layers were formed by magnetron sputtering. It has been established that the adhesion strength of all functional layers on the photomasks and photomask blanks differs insignificantly, while the adhesion profiles on their surfaces are similar. The adhesion strength of the Cr, MoSiN, MoSiN/Cr layers formed by magnetron sputtering on quartz substrates from different manufacturers is no less than 1800 g/mm2, but in some cases cohesive destruction of quartz is observed with a tear-off force of about 1400 g/mm2. When considering the adhesion mechanisms of the functional layers, it was found that the adhesion strength is determined mainly by the Van der Waals forces. During functional layers adhesion strength measuring, in 60 % of cases there was a cohesive destruction of the quartz substrate. Cohesive destruction of the Si–O covalent bonds occurred at a quartz substrate depth of more than 150 nm. The investigation results have demonstrated high adhesion strength values of the formed functional layers of photomasks and photomask blanks.

Key words: photomask, functional film layers, adhesion strength, adhesion mechanisms
Published in: TECHNOLOGICAL PROCESSES
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UDK: 539.216.2:539.61
Publication type: Scientific article
Source lang: Russian
DOI: 10.24151/1561-5405-2026-31-2-143-157
RISC id: PICDBJ

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